K9F1G08U0D-HCB0T by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K9F1G08U0D-HCB0T
Description	FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: FBGA; Package Shape: RECTANGULAR; No. of Words Code: 128M;
Datasheet	K9F1G08U0D-HCB0T Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00008 Amp
Organization:	128MX8
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	35 mA
Command User Interface:	YES
No. of Terminals:	63
No. of Words:	134217728 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B63
No. of Sectors/Size:	1K
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	70 Cel
Package Code:	FBGA
Memory Density:	1073741824 bit
Sector Size (Words):	128K
Toggle Bit:	NO
Memory IC Type:	FLASH
Minimum Operating Temperature:	0 Cel
Memory Width:	8
Page Size (words):	2K
Type:	SLC NAND TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA63,10X12,32
Maximum Access Time:	20 ns
No. of Words Code:	128M
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Data Polling:	NO
Power Supplies (V):	3/3.3

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