K9F6408Q0C-HCB0 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	K9F6408Q0C-HCB0
Description	FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: FBGA; Package Shape: RECTANGULAR; Technology: CMOS;
Datasheet	K9F6408Q0C-HCB0 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.00005 Amp
Organization:	8MX8
Sub-Category:	Flash Memories
Surface Mount:	YES
Maximum Supply Current:	15 mA
Command User Interface:	YES
No. of Terminals:	48
No. of Words:	8388608 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B48
No. of Sectors/Size:	1K
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	70 Cel
Package Code:	FBGA
Memory Density:	67108864 bit
Sector Size (Words):	8K
Toggle Bit:	NO
Memory IC Type:	FLASH
Minimum Operating Temperature:	0 Cel
Memory Width:	8
Page Size (words):	512
Type:	SLC NAND TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA48,6X8,32
Maximum Access Time:	35 ns
No. of Words Code:	8M
Nominal Supply Voltage / Vsup (V):	1.8
Ready or Busy:	YES
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Data Polling:	NO
Power Supplies (V):	1.8

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