KLMAG2WEMB-B0310 by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	KLMAG2WEMB-B0310
Description	FLASH CARD; Package Code: BGA; Package Shape: RECTANGULAR; Surface Mount: YES; Type: MLC NAND TYPE; No. of Words: 17179869184 words;
Datasheet	KLMAG2WEMB-B0310 Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	16GX8
Maximum Seated Height:	.8 mm
Programming Voltage (V):	5
Surface Mount:	YES
Maximum Clock Frequency (fCLK):	200 MHz
No. of Words:	17179869184 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Package Code:	BGA
Width:	11.5 mm
Memory Density:	137438953472 bit
Memory IC Type:	FLASH CARD
Memory Width:	8
No. of Functions:	1
Type:	MLC NAND TYPE
Length:	13 mm
No. of Words Code:	16G
Nominal Supply Voltage / Vsup (V):	5
Additional Features:	ALSO ORGANISED AS 64Gbx2

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