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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | KLMCG8GESD-B04Q |
| Description | Embedded MMC; No. of Terminals: 153; Package Code: VFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH; Package Equivalence Code: BGA153,14X14,20; |
| Datasheet | KLMCG8GESD-B04Q Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 64GX8 |
| Maximum Seated Height: | 1 mm |
| Programming Voltage (V): | 1.8 |
| Surface Mount: | YES |
| No. of Terminals: | 153 |
| No. of Words: | 68719476736 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B153 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 105 Cel |
| Package Code: | VFBGA |
| Width: | 11.5 mm |
| Memory Density: | 549755813888 bit |
| Memory IC Type: | Embedded MMC |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Type: | NOR TYPE |
| Package Equivalence Code: | BGA153,14X14,20 |
| Length: | 13 mm |
| No. of Words Code: | 64G |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | CAN BE OPERATED AT 3.3V SUPPLY |
| Terminal Pitch: | .5 mm |
