Samsung - KS58505

  1. Home
  2. Samsung - KS58505
KS58505 by Samsung

Image shown is a representation only.

Manufacturer Samsung
Manufacturer's Part Number KS58505
Description TELEPHONE DIALER CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 5.08 mm;
Datasheet KS58505 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Telecom IC Type: TELEPHONE DIALER CIRCUIT
Maximum Seated Height: 5.08 mm
Surface Mount: NO
No. of Functions: 1
No. of Terminals: 22
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Length: 27.48 mm
JESD-30 Code: R-PDIP-T22
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Package Code: DIP
Width: 10.16 mm
Terminal Pitch: 2.54 mm
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

MC33218ADW by Motorola

MC33218ADW

Motorola

SPEAKER PHONE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;
MT88E39AS1 by Microchip Technology

MT88E39AS1

Microchip Technology

MT88E39AS1 by Microchip Technology is a Telephone Line IC in a small outline package. It operates b/w -40 to 85°C with 3V supply voltage. This CMOS technology chip has 16 terminals, matte tin finish, and is used for telephone calling number identification circuits.
TCM1531P by Texas Instruments

TCM1531P

Texas Instruments

TCM1531P by Texas Instruments is a Telephone Line IC with BICMOS technology. It features 8 terminals in an IN-LINE package style, operating b/w -20°C to 70°C. Ideal for TELEPHONE RINGER CIRCUIT applications due to its low supply current of 0.0013 mA and compact dimensions of 7.62mm x 9.81mm x 5.08mm.
HA16804PS by Renesas Electronics

HA16804PS

Renesas Electronics

TELEPHONE RINGER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
TCM5091N by Texas Instruments

TCM5091N

Texas Instruments

Texas Instruments TCM5091N is a Telephone Line IC with 18 terminals in an IN-LINE package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Utilizes CMOS technology and features dual terminal position in a rectangular plastic/epoxy body.
KS5809N by Samsung

KS5809N

Samsung

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
PCD3344T/011 by NXP Semiconductors

PCD3344T/011

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
935263449118 by NXP Semiconductors

935263449118

NXP Semiconductors

SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: SSOP; Package Shape: RECTANGULAR;
PCD3311TD-T by NXP Semiconductors

PCD3311TD-T

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TCM1536P-00 by Texas Instruments

TCM1536P-00

Texas Instruments

TCM1536P-00 by Texas Instruments is a Telephone Line IC with 8 terminals, operating temp. range of -20 to 70°C. It features a rectangular plastic/epoxy package style suitable for telephone ringer circuits. Dimensions: 7.62mm width, 5.08mm max seated height, and terminal pitch of 2.54mm make it ideal for commercial telecom applications.
PCD3311CP by NXP Semiconductors

PCD3311CP

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
F1180NBGI8 by Renesas Electronics

F1180NBGI8

Renesas Electronics

TELECOM CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Terminal Finish: TIN;
TEA1096N by NXP Semiconductors

TEA1096N

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
TCM1532P by Texas Instruments

TCM1532P

Texas Instruments

TCM1532P by Texas Instruments is a Telephone Ringer Circuit IC with BICMOS technology. It has 8 terminals in an IN-LINE package style, operating b/w -20°C to 70°C. Ideal for telecom applications due to its compact size (9.81mm x 7.62mm x 5.08mm) and dual terminal position design.
TA31065F(ER) by Toshiba

TA31065F(ER)

Toshiba

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
PCD3310HP by NXP Semiconductors

PCD3310HP

NXP Semiconductors

PCD3310HP by NXP Semiconductors is a telephone dialer circuit IC designed for efficient telecom applications. It operates at a nominal voltage of 3V, with a max current of 0.2mA and supports temperatures from -25 °C to 70 °C. Its compact design features 20 terminals in an in-line package, ideal for space-constrained environments.
TEA1062AT/C4,112 by NXP Semiconductors

TEA1062AT/C4,112

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TCM1520AD by Texas Instruments

TCM1520AD

Texas Instruments

TCM1520AD by Texas Instruments is a Telephone Line IC with BICMOS technology. It operates b/w -40 to 85°C, with power supplies of 40/150V and max supply current of 0.0016mA. This TELEPHONE RINGER CIRCUIT has 8 terminals in a small outline package for industrial applications.
935263448557 by NXP Semiconductors

935263448557

NXP Semiconductors

SPEAKER PHONE CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: QFP; Package Shape: SQUARE;
TEA1062A/C4,112 by NXP Semiconductors

TEA1062A/C4,112

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;