MZ-77E500B/CN by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	MZ-77E500B/CN
Description	FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Organization: 500GX8; Operating Mode: ASYNCHRONOUS; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
Datasheet	MZ-77E500B/CN Datasheet

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Memory Density:	4294967296000 bit
Organization:	500GX8
Maximum Seated Height:	6.8 mm
Surface Mount:	NO
Memory IC Type:	FLASH MODULE
Minimum Operating Temperature:	0 Cel
Memory Width:	8
No. of Functions:	1
Type:	NAND TYPE
No. of Words:	536870912000 words
Terminal Position:	UNSPECIFIED
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Length:	100 mm
Technology:	CMOS
No. of Words Code:	500G
JESD-30 Code:	R-XXMA-X
Package Shape:	RECTANGULAR
Terminal Form:	UNSPECIFIED
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	XMA
Width:	69.85 mm

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