MZ-N6E250BW by Samsung | Memory ICs

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Manufacturer	Samsung
Manufacturer's Part Number	MZ-N6E250BW
Description	FLASH MODULE; Package Code: XMA; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Type: MLC NAND TYPE; Maximum Operating Temperature: 70 Cel;
Datasheet	MZ-N6E250BW Datasheet

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Memory Density:	2147483648000 bit
Organization:	250GX8
Surface Mount:	NO
Memory IC Type:	FLASH MODULE
Minimum Operating Temperature:	0 Cel
Memory Width:	8
No. of Functions:	1
Type:	MLC NAND TYPE
No. of Words:	268435456000 words
Terminal Position:	UNSPECIFIED
Package Style (Meter):	MICROELECTRONIC ASSEMBLY
Technology:	CMOS
No. of Words Code:	250G
JESD-30 Code:	R-XXMA-N
Package Shape:	RECTANGULAR
Terminal Form:	NO LEAD
Maximum Operating Temperature:	70 Cel
Parallel or Serial:	SERIAL
Package Code:	XMA

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