Samsung - S3C2460B01-YL7Z

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S3C2460B01-YL7Z by Samsung

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Manufacturer Samsung
Manufacturer's Part Number S3C2460B01-YL7Z
Description MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: FBGA; Package Shape: SQUARE;
Datasheet S3C2460B01-YL7Z Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Speed: 40 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Sub-Category: Microprocessors
Surface Mount: YES
Bit Size: 32
Maximum Supply Current: .1 mA
Minimum Operating Temperature: -40 Cel
No. of Terminals: 400
Qualification: Not Qualified
Package Equivalence Code: BGA400,23X23,20
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B400
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.8/3.3
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