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Manufacturer | Samsung |
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Manufacturer's Part Number | SIP007AFS001 |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 271; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; |
Datasheet | SIP007AFS001 Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 3.7 V |
Package Body Material: | UNSPECIFIED |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Nominal Supply Voltage: | 4.2 V |
Maximum Supply Voltage: | 5 V |
Maximum Seated Height: | 3.45 mm |
Surface Mount: | NO |
Minimum Operating Temperature: | 0 Cel |
No. of Terminals: | 271 |
Terminal Position: | UNSPECIFIED |
Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
Length: | 49 mm |
Technology: | CMOS |
JESD-30 Code: | R-XXMA-X271 |
Package Shape: | RECTANGULAR |
Terminal Form: | UNSPECIFIED |
Maximum Operating Temperature: | 70 Cel |
Width: | 36 mm |
Terminal Pitch: | 1.13 mm |
Temperature Grade: | COMMERCIAL |