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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | SIP007AFS001 |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: UNSPECIFIED; No. of Terminals: 271; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; |
| Datasheet | SIP007AFS001 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 3.7 V |
| Other Names: | 1683-1001 |
| Package Body Material: | UNSPECIFIED |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 4.2 V |
| Maximum Supply Voltage: | 5 V |
| Maximum Seated Height: | 3.45 mm |
| Surface Mount: | NO |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 271 |
| Terminal Position: | UNSPECIFIED |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Length: | 49 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-XXMA-X271 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | UNSPECIFIED |
| Maximum Operating Temperature: | 70 Cel |
| Width: | 36 mm |
| Terminal Pitch: | 1.13 mm |
| Temperature Grade: | COMMERCIAL |









