Samtec - MVAT-209-DG-17

IC SOCKET; Housing Material: NYLON; Termination Type: SOLDER; No. of Contacts: 11; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;

TE Connectivity 7-1437539-6 is a DIP24 IC SOCKET with 24 contacts, rated at 3A current. It has a PCB contact row spacing of 7.49mm and uses SOLDER termination. Ideal for applications requiring a RECTANGULAR PCB contact pattern and POLYESTER housing material.

RELAY SOCKET;

IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;

IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD FLASH; Contact Finish (Mating): GOLD FLASH; JESD-609 Code: e4; Manufacturer Series: XR2;

Samtec's HLT-0716-G-H is a 112-contact IC socket with brass contacts and gold finish. It is designed for use on PGA112 devices, featuring a plastic housing material. Ideal for chip carrier applications requiring reliable connections in electronic systems.

110-87-628-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, rated for 1A current. It features Beryllium Copper contacts with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing material. With a temperature range of -55 to 125 °C, it's ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capability up to 1400VAC.

TE Connectivity 6-1437514-7 is a Chip Carrier IC Socket with PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. It operates b/w -65°C to 125°C, suitable for various electronic applications requiring reliable connections.

IC SOCKET; Device Type Used On: QFP120; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 120;

IC SOCKET; Device Type Used On: QFP100; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 100VAC; Housing Material: PLASTIC;

TE Connectivity's 6-1415035-1 is an IC socket with 8 contacts, rated for 16A current. With a body size of 3.031" x 0.622" x 2.421", it operates b/w -40°C to 70°C and uses screw termination. Ideal for chip carrier ICs on relays.

RELAY SOCKET;

IC SOCKET; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED;

IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYBUTYLENE TEREPHTHALATE; JESD-609 Code: e4; No. of Contacts: 32; Contact Finish (Mating): NOT SPECIFIED;

Mill-max Mfg's 342-90-139-00-593000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Ni barrier. Ideal for Chip Carrier IC & Component Sockets applications.

IC SOCKET; Manufacturer Series: XR2;

Samtec's ICF-624-S-I is a Chip Carrier IC Socket with 24 contacts, featuring a PCB contact row spacing of 15.24mm and rectangular contact pattern. It uses liquid crystal polymer housing material and has a mating contact pitch of 0.1". Ideal for DIP24 devices, it operates b/w -55°C to 125°C, with termination type as surface mount.

IC SOCKET; Device Type Used On: SIP1; Housing Material: POLYETHYLENE; No. of Contacts: 1; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;

150-10-324-00-018101 by Preci-dip Sa is a DIP24 IC socket with 24 brass contacts and gold finish. Its housing material is POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. Ideal for chip carrier applications, this socket offers reliable connectivity and durability in electronic devices.

IC SOCKET; Manufacturer Series: 8134-HC;