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| Manufacturer | Silicon Labs |
|---|---|
| Manufacturer's Part Number | EFR32BG21A010F1024IM32-B |
| Description | TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; |
| Datasheet | EFR32BG21A010F1024IM32-B Datasheet |
| In Stock | 1,646 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | .9 mm |
| Surface Mount: | YES |
| No. of Terminals: | 32 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Data Rate: | 2 Mbps |
| JESD-30 Code: | S-XQCC-N32 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | HVQCCN |
| Width: | 4 mm |
| Moisture Sensitivity Level (MSL): | 2 |
| Other Names: | -1546-EFR32BG21A010F1024IM32-B |
| Telecom IC Type: | TELECOM CIRCUIT |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Package Equivalence Code: | LCC32,.16SQ,16 |
| Length: | 4 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | AUTOMOTIVE |









