E-STLC61265 by STMicroelectronics | Telecommunications

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	E-STLC61265
Description	TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
Datasheet	E-STLC61265 Datasheet
In Stock	2,174

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.2 V
Telecom IC Type:	TELECOM CIRCUIT
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
No. of Functions:	1
No. of Terminals:	676
Qualification:	Not Qualified
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	S-PBGA-B676
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	BGA
Temperature Grade:	INDUSTRIAL
Moisture Sensitivity Level (MSL):	3

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,174	-	-

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