STMicroelectronics - HCF40108BF

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HCF40108BF by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number HCF40108BF
Description Other Memory ICs; Temperature Grade: INDUSTRIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Pitch: 2.54 mm;
Datasheet HCF40108BF Datasheet
In Stock3,678
NAME DESCRIPTION
Package Body Material: CERAMIC
Sub-Category: Other Memory ICs
Surface Mount: NO
Minimum Operating Temperature: -40 Cel
No. of Terminals: 24
Qualification: Not Qualified
Package Equivalence Code: DIP24,.6
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-XDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 85 Cel
Package Code: DIP
Terminal Pitch: 2.54 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/15
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