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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | M2364B1 |
Description | MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 250 ns; |
Datasheet | M2364B1 Datasheet |
In Stock | 3,711 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 8KX8 |
Sub-Category: | MASK ROMs |
Surface Mount: | NO |
Maximum Supply Current: | 80 mA |
Terminal Finish: | Tin/Lead (Sn/Pb) |
No. of Terminals: | 24 |
No. of Words: | 8192 words |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | MOS |
JESD-30 Code: | R-PDIP-T24 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Memory Density: | 65536 bit |
Memory IC Type: | MASK ROM |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 8 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP24,.6 |
Maximum Access Time: | 250 ns |
No. of Words Code: | 8K |
Nominal Supply Voltage / Vsup (V): | 5 |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 5 |