STMicroelectronics - M2364B1

M2364B1 by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number M2364B1
Description MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Access Time: 250 ns;
Datasheet M2364B1 Datasheet
In Stock3,711
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 8KX8
Sub-Category: MASK ROMs
Surface Mount: NO
Maximum Supply Current: 80 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 24
No. of Words: 8192 words
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: MOS
JESD-30 Code: R-PDIP-T24
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Memory Density: 65536 bit
Memory IC Type: MASK ROM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 8
Qualification: Not Qualified
Package Equivalence Code: DIP24,.6
Maximum Access Time: 250 ns
No. of Words Code: 8K
Nominal Supply Voltage / Vsup (V): 5
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 5
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