M58BW032BB55ZA3 by STMicroelectronics | Memory ICs

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	M58BW032BB55ZA3
Description	FLASH; Temperature Grade: AUTOMOTIVE; No. of Terminals: 80; Package Code: BGA; Package Shape: RECTANGULAR; No. of Words Code: 1M;
Datasheet	M58BW032BB55ZA3 Datasheet
In Stock	1,911

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.0001 Amp
Organization:	1MX32
Sub-Category:	Flash Memories
Surface Mount:	YES
Command User Interface:	YES
No. of Terminals:	80
No. of Words:	1048576 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B80
No. of Sectors/Size:	4,8,62
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Package Code:	BGA
Boot Block:	BOTTOM
Memory Density:	33554432 bit
Sector Size (Words):	4K,2K,16K
Toggle Bit:	NO
Memory IC Type:	FLASH
Minimum Operating Temperature:	-40 Cel
Memory Width:	32
Page Size (words):	4
Type:	NOR TYPE
Qualification:	Not Qualified
Package Equivalence Code:	BGA80,8X10,40
Common Flash Interface:	YES
Maximum Access Time:	55 ns
No. of Words Code:	1M
Nominal Supply Voltage / Vsup (V):	3.3
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	AUTOMOTIVE
Data Polling:	NO
Power Supplies (V):	3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
1,911	-	-

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