STMicroelectronics - M65KG512AB8W9

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M65KG512AB8W9 by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number M65KG512AB8W9
Description DDR1 DRAM; Temperature Grade: OTHER; Package Code: DIE; Package Shape: UNSPECIFIED; Technology: CMOS; Memory Density: 536870912 bit;
Datasheet M65KG512AB8W9 Datasheet
In Stock2,251
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Organization: 32MX16
Access Mode: FOUR BANK PAGE BURST
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
No. of Words: 33554432 words
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
Technology: CMOS
JESD-30 Code: X-XUUC-N
Package Shape: UNSPECIFIED
Terminal Form: NO LEAD
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 105 Cel
Package Code: DIE
No. of Ports: 1
Memory Density: 536870912 bit
Self Refresh: YES
Memory IC Type: DDR1 DRAM
Minimum Operating Temperature: -30 Cel
Memory Width: 16
No. of Functions: 1
Qualification: Not Qualified
Maximum Access Time: 6 ns
No. of Words Code: 32M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: AUTO/SELF REFRESH
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 1.9 V
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