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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | NAND01GW3M2CZB5F |
| Description | MEMORY CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; No. of Terminals: 137; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm; |
| Datasheet | NAND01GW3M2CZB5F Datasheet |
| In Stock | 1,826 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 128MX8 |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 2.5 V |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| No. of Terminals: | 137 |
| No. of Words: | 134217728 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B137 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 10.5 mm |
| Memory Density: | 1073741824 bit |
| Mixed Memory Type: | FLASH+SDRAM |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -30 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA137,10X15,32 |
| Length: | 13 mm |
| No. of Words Code: | 128M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Additional Features: | LPSDRAM IS ORGANISED AS 16M X 32 |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | COMMERCIAL EXTENDED |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3 |
