NAND01GW4B2BZA1F by STMicroelectronics | Memory ICs

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Manufacturer	STMicroelectronics
Manufacturer's Part Number	NAND01GW4B2BZA1F
Description	FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: TFBGA; Package Shape: RECTANGULAR; Qualification: Not Qualified;
Datasheet	NAND01GW4B2BZA1F Datasheet
In Stock	2,597

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	64MX16
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1.05 mm
Programming Voltage (V):	3
Minimum Supply Voltage (Vsup):	2.7 V
Surface Mount:	YES
No. of Terminals:	63
No. of Words:	67108864 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, THIN PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	R-PBGA-B63
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	TFBGA
Width:	9 mm
Memory Density:	1073741824 bit
Memory IC Type:	FLASH
Minimum Operating Temperature:	0 Cel
Memory Width:	16
No. of Functions:	1
Qualification:	Not Qualified
Length:	11 mm
Maximum Access Time:	25000 ns
No. of Words Code:	64M
Nominal Supply Voltage / Vsup (V):	3
Peak Reflow Temperature (C):	NOT SPECIFIED
Parallel or Serial:	PARALLEL
Terminal Pitch:	.8 mm
Temperature Grade:	COMMERCIAL
Maximum Supply Voltage (Vsup):	3.6 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
2,597	-	-

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