STMicroelectronics - NAND08GW3B3CZC1F

NAND08GW3B3CZC1F by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number NAND08GW3B3CZC1F
Description FLASH; Temperature Grade: COMMERCIAL; No. of Terminals: 63; Package Code: LFBGA; Package Shape: RECTANGULAR; Surface Mount: YES;
Datasheet NAND08GW3B3CZC1F Datasheet
In Stock1,030
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 1GX8
Maximum Seated Height: 1.4 mm
Programming Voltage (V): 3
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 63
No. of Words: 1073741824 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B63
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: LFBGA
Width: 8.5 mm
Memory Density: 8589934592 bit
Memory IC Type: FLASH
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Length: 15 mm
Maximum Access Time: 35 ns
No. of Words Code: 1G
Nominal Supply Voltage / Vsup (V): 3
Parallel or Serial: PARALLEL
Terminal Pitch: .8 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
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