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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | NAND256W3M4AZBE |
| Description | MEMORY CIRCUIT; Temperature Grade: OTHER; No. of Terminals: 149; Package Code: TFBGA; Package Shape: RECTANGULAR; No. of Functions: 1; |
| Datasheet | NAND256W3M4AZBE Datasheet |
| In Stock | 2,956 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 16MX16 |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 2.5 V |
| Surface Mount: | YES |
| No. of Terminals: | 149 |
| No. of Words: | 16777216 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B149 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 10 mm |
| Memory Density: | 268435456 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| Minimum Operating Temperature: | -30 Cel |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Length: | 13.5 mm |
| No. of Words Code: | 16M |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Maximum Supply Voltage (Vsup): | 3.6 V |
