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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | STH3N150-2 |
Description | N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 140 W; Terminal Finish: MATTE TIN; Terminal Form: GULL WING; |
Datasheet | STH3N150-2 Datasheet |
In Stock | 23,488 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Configuration: | SINGLE WITH BUILT-IN DIODE |
Transistor Element Material: | SILICON |
Field Effect Transistor Technology: | METAL-OXIDE SEMICONDUCTOR |
Transistor Application: | SWITCHING |
Maximum Drain Current (ID): | 2.5 A |
Maximum Pulsed Drain Current (IDM): | 10 A |
Sub-Category: | FET General Purpose Powers |
Surface Mount: | YES |
Terminal Finish: | MATTE TIN |
No. of Terminals: | 2 |
Maximum Power Dissipation (Abs): | 140 W |
Terminal Position: | SINGLE |
Package Style (Meter): | SMALL OUTLINE |
JESD-30 Code: | R-PSSO-G2 |
No. of Elements: | 1 |
Package Shape: | RECTANGULAR |
Terminal Form: | GULL WING |
Operating Mode: | ENHANCEMENT MODE |
Maximum Operating Temperature: | 150 Cel |
Case Connection: | DRAIN |
Maximum Drain-Source On Resistance: | 9 ohm |
Moisture Sensitivity Level (MSL): | 3 |
Avalanche Energy Rating (EAS): | 450 mJ |
Polarity or Channel Type: | N-CHANNEL |
JESD-609 Code: | e3 |
Minimum DS Breakdown Voltage: | 1500 V |
Maximum Drain Current (Abs) (ID): | 2.5 A |
Peak Reflow Temperature (C): | 260 |