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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | STM32MP157AAA3T |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | STM32MP157AAA3T Datasheet |
In Stock | 1,853 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .85 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | .9 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1.32 mm |
Surface Mount: | YES |
Maximum Supply Current: | 1000 mA |
On Chip Data RAM Width: | 8 |
No. of Terminals: | 448 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
No. of DMA Channels: | 48 |
Address Bus Width: | 26 |
Technology: | CMOS |
RAM Words: | 724992 |
JESD-30 Code: | S-PBGA-B448 |
Maximum Clock Frequency: | 64 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | LFBGA |
Width: | 18 mm |
Speed: | 650 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.25 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 0 |
Bit Size: | 32 |
Minimum Operating Temperature: | -40 Cel |
Package Equivalence Code: | BGA448,22X22,32 |
Length: | 18 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .8 mm |
Temperature Grade: | INDUSTRIAL |