STMicroelectronics - STM32W108HBU74

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STM32W108HBU74 by STMicroelectronics

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Manufacturer STMicroelectronics
Manufacturer's Part Number STM32W108HBU74
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
Datasheet STM32W108HBU74 Datasheet
In Stock3,332
NAME DESCRIPTION
Minimum Supply Voltage: 1.18 V
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 1.25 V
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1 mm
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 150 mA
No. of Terminals: 40
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Technology: CMOS
JESD-30 Code: S-XQCC-N40
Package Shape: SQUARE
ROM Words: 131072
Terminal Form: NO LEAD
Maximum Operating Temperature: 105 Cel
Package Code: HVQCCN
Width: 6 mm
Speed: 24 rpm
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.32 V
RAM Bytes: 8192
Bit Size: 32
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: LCC40,.24SQ,20
Length: 6 mm
Peak Reflow Temperature (C): NOT SPECIFIED
ROM Programmability: FLASH
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 2.5/3.3
CPU Family: CORTEX-M3
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