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Manufacturer | STMicroelectronics |
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Manufacturer's Part Number | STV0987B/TR |
Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 104; Package Code: BGA; Package Shape: UNSPECIFIED; |
Datasheet | STV0987B/TR Datasheet |
In Stock | 1,187 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER NICKEL |
JESD-609 Code: | e2 |
Minimum Operating Temperature: | -25 Cel |
No. of Terminals: | 104 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | X-PBGA-B104 |
Package Shape: | UNSPECIFIED |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Peak Reflow Temperature (C): | 260 |
Package Code: | BGA |
Temperature Grade: | OTHER |
Moisture Sensitivity Level (MSL): | 3 |