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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | STV0987B/TR |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 104; Package Code: BGA; Package Shape: UNSPECIFIED; |
| Datasheet | STV0987B/TR Datasheet |
| In Stock | 1,187 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER NICKEL |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | -25 Cel |
| No. of Terminals: | 104 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | X-PBGA-B104 |
| Package Shape: | UNSPECIFIED |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | BGA |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 3 |









