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| Manufacturer | STMicroelectronics |
|---|---|
| Manufacturer's Part Number | TESEO-LIV3F |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 18; Package Shape: RECTANGULAR; No. of Functions: 1; |
| Datasheet | TESEO-LIV3F Datasheet |
| In Stock | 1,861 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
497-18163-2 497-18163-ND 497-18163-1 497-18163-6 497-18163 TESEO-LIV3F-ND |
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 3.3 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 2.3 mm |
| Surface Mount: | NO |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 18 |
| Terminal Position: | DUAL |
| Package Style (Meter): | MICROELECTRONIC ASSEMBLY |
| Length: | 10.1 mm |
| JESD-30 Code: | R-XDMA-N18 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Width: | 9.7 mm |
| Terminal Pitch: | 1.1 mm |
| Temperature Grade: | INDUSTRIAL |
