BZV55B39L1G by Taiwan Semiconductor | Diodes

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Manufacturer	Taiwan Semiconductor
Manufacturer's Part Number	BZV55B39L1G
Description	ZENER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Datasheet	BZV55B39L1G Datasheet

NAME	DESCRIPTION
Package Body Material:	GLASS
Working Test Current:	2.5 mA
Config:	SINGLE
Diode Type:	ZENER DIODE
Surface Mount:	YES
Terminal Finish:	MATTE TIN OVER NICKEL
Maximum Reverse Current:	.1 uA
No. of Terminals:	2
Terminal Position:	END
Package Style (Meter):	LONG FORM
Technology:	ZENER
JESD-30 Code:	O-LELF-R2
No. of Elements:	1
Package Shape:	ROUND
Terminal Form:	WRAP AROUND
Polarity:	UNIDIRECTIONAL
Maximum Operating Temperature:	175 Cel
Case Connection:	ISOLATED
Maximum Knee Impedance:	500 ohm
Maximum Dynamic Impedance:	90 ohm
Moisture Sensitivity Level (MSL):	1
Reverse Test Voltage:	28 V
JESD-609 Code:	e3
Minimum Operating Temperature:	-65 Cel
Maximum Voltage Tolerance:	2 %
Diode Element Material:	SILICON
Nominal Reference Voltage:	39 V
Maximum Power Dissipation:	.5 W

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