TSM2N7002KCXRFG by Taiwan Semiconductor | Transistors

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Manufacturer	Taiwan Semiconductor
Manufacturer's Part Number	TSM2N7002KCXRFG
Description	N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .357 W; Transistor Application: SWITCHING; Minimum Operating Temperature: -55 Cel;
Datasheet	TSM2N7002KCXRFG Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s):	30
Configuration:	SINGLE WITH BUILT-IN DIODE
Transistor Element Material:	SILICON
Field Effect Transistor Technology:	METAL-OXIDE SEMICONDUCTOR
Transistor Application:	SWITCHING
Maximum Drain Current (ID):	.3 A
Surface Mount:	YES
Terminal Finish:	TIN
No. of Terminals:	3
Maximum Power Dissipation (Abs):	.357 W
Terminal Position:	DUAL
Package Style (Meter):	SMALL OUTLINE
JESD-30 Code:	R-PDSO-G3
No. of Elements:	1
Package Shape:	RECTANGULAR
Terminal Form:	GULL WING
Operating Mode:	ENHANCEMENT MODE
Maximum Operating Temperature:	150 Cel
Maximum Power Dissipation Ambient:	.357 W
Maximum Drain-Source On Resistance:	2 ohm
Moisture Sensitivity Level (MSL):	3
Other Names:	TSM2N7002KCX RFGTR TSM2N7002KCX RFGTR-ND TSM2N7002KCX RFGCT TSM2N7002KCX RFGCT-ND TSM2N7002KCXRFGCT TSM2N7002KCX RFGDKR-ND TSM2N7002KCXRFGDKR TSM2N7002KCX RFGDKR TSM2N7002KCXRFGTR
Maximum Feedback Capacitance (Crss):	6 pF
Polarity or Channel Type:	N-CHANNEL
JESD-609 Code:	e3
Minimum Operating Temperature:	-55 Cel
Minimum DS Breakdown Voltage:	60 V
Qualification:	Not Qualified
Peak Reflow Temperature (C):	260

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