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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | 5962-01-165-3112 |
Description | OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE; |
Datasheet | 5962-01-165-3112 Datasheet |
In Stock | 2,472 |
NAME | DESCRIPTION |
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Package Body Material: | CERAMIC |
Organization: | 256X4 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Sub-Category: | OTP ROMs |
Surface Mount: | NO |
Maximum Supply Current: | 100 mA |
No. of Terminals: | 16 |
No. of Words: | 256 words |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | TTL |
JESD-30 Code: | R-XDIP-T16 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Memory Density: | 1024 bit |
Memory IC Type: | OTP ROM |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 4 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP16,.3 |
Maximum Access Time: | 65 ns |
No. of Words Code: | 256 |
Nominal Supply Voltage / Vsup (V): | 5 |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 5 |