Texas Instruments - CP3SP33SMS/NOPB

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CP3SP33SMS/NOPB by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number CP3SP33SMS/NOPB
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 224; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet CP3SP33SMS/NOPB Datasheet
In Stock4,870
NAME DESCRIPTION
Minimum Supply Voltage: 1.62 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.4 mm
Sub-Category: Microcontrollers
Surface Mount: YES
Maximum Supply Current: 200 mA
Terminal Finish: TIN LEAD
No. of Terminals: 224
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B224
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Speed: 96 rpm
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.98 V
RAM Bytes: 32768
External Data Bus Width: 32
Bit Size: 16
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA224,15X15,32
Length: 13 mm
Peak Reflow Temperature (C): 260
Bus Compatibility: I2C; I2S; SPI; UART; USB
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 1.8
CPU Family: CR16C
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Pricing (USD)

Qty. Unit Price Ext. Price
4,870 $20.920 $101,880.400

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