DM355SDZCE135 by Texas Instruments | Peripheral ICs

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Manufacturer	Texas Instruments
Manufacturer's Part Number	DM355SDZCE135
Description	MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 337; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet	DM355SDZCE135 Datasheet
In Stock	4,909

NAME	DESCRIPTION
Minimum Supply Voltage:	1.235 V
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	1.3 V
Maximum Time At Peak Reflow Temperature (s):	30
Maximum Seated Height:	1.3 mm
Sub-Category:	Digital Signal Processors
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	337
Terminal Position:	BOTTOM
Format:	FIXED POINT
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
Technology:	CMOS
RAM Words:	8192
JESD-30 Code:	S-PBGA-B337
Package Shape:	SQUARE
Terminal Form:	BALL
Maximum Operating Temperature:	85 Cel
Package Code:	LFBGA
Width:	13 mm
Moisture Sensitivity Level (MSL):	3
Peripheral IC Type:	MICROPROCESSOR CIRCUIT
Maximum Supply Voltage:	1.365 V
Bit Size:	32
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
Qualification:	Not Qualified
Package Equivalence Code:	BGA337,19X19,25
Length:	13 mm
Additional Features:	IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O
Peak Reflow Temperature (C):	260
Terminal Pitch:	.65 mm
Temperature Grade:	OTHER
Power Supplies (V):	1.3,1.8,3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
4,909	-	-

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