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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | DRA746APGABCQ1 |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: BGA; Package Shape: UNSPECIFIED; |
| Datasheet | DRA746APGABCQ1 Datasheet |
| In Stock | 720 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: | 296-DRA746APGABCQ1 |
| Package Body Material: | PLASTIC/EPOXY |
| Speed: | 1500 rpm |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| JESD-609 Code: | e1 |
| No. of Terminals: | 760 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Screening Level: | AEC-Q100 |
| Technology: | CMOS |
| JESD-30 Code: | X-PBGA-B760 |
| Package Shape: | UNSPECIFIED |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | 250 |
| Package Code: | BGA |
| Temperature Grade: | AUTOMOTIVE |
| Moisture Sensitivity Level (MSL): | 3 |









