HPA01195YFPR by Texas Instruments | Telecommunications

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Manufacturer	Texas Instruments
Manufacturer's Part Number	HPA01195YFPR
Description	TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 28; Package Code: VFBGA; Package Shape: RECTANGULAR;
Datasheet	HPA01195YFPR Datasheet
In Stock	312

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Nominal Supply Voltage:	5 V
Maximum Time At Peak Reflow Temperature (s):	30
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.5 mm
Surface Mount:	YES
Terminal Finish:	Tin/Silver/Copper (Sn/Ag/Cu)
JESD-609 Code:	e1
Minimum Operating Temperature:	0 Cel
No. of Functions:	1
No. of Terminals:	28
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Length:	3 mm
JESD-30 Code:	R-PBGA-B28
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Maximum Operating Temperature:	125 Cel
Peak Reflow Temperature (C):	260
Package Code:	VFBGA
Width:	1.88 mm
Terminal Pitch:	.4 mm
Temperature Grade:	OTHER
Moisture Sensitivity Level (MSL):	1

Pricing (USD)

Qty.	Unit Price	Ext. Price
312	-	-

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RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;

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RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;