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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | HPA02270YZPR |
Description | INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 8; Package Code: VFBGA; Package Shape: RECTANGULAR; |
Datasheet | HPA02270YZPR Datasheet |
In Stock | 624 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.65 V |
Package Body Material: | UNSPECIFIED |
Nominal Supply Voltage: | 1.8 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .5 mm |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 8 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
JESD-30 Code: | R-XBGA-B8 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | VFBGA |
Interface IC Type: | INTERFACE CIRCUIT |
Width: | .888 mm |
Moisture Sensitivity Level (MSL): | 1 |
Maximum Supply Voltage: | 3.6 V |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Length: | 1.888 mm |
Additional Features: | ALSO REQUIRED VCCB = 2.3V TO 5.5V SUPPLY |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .5 mm |
Temperature Grade: | INDUSTRIAL |