Texas Instruments - HPA02270YZPR

HPA02270YZPR by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number HPA02270YZPR
Description INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 8; Package Code: VFBGA; Package Shape: RECTANGULAR;
Datasheet HPA02270YZPR Datasheet
In Stock624
NAME DESCRIPTION
Minimum Supply Voltage: 1.65 V
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 1.8 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: .5 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 8
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH
JESD-30 Code: R-XBGA-B8
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: VFBGA
Interface IC Type: INTERFACE CIRCUIT
Width: .888 mm
Moisture Sensitivity Level (MSL): 1
Maximum Supply Voltage: 3.6 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
Length: 1.888 mm
Additional Features: ALSO REQUIRED VCCB = 2.3V TO 5.5V SUPPLY
Peak Reflow Temperature (C): 260
Terminal Pitch: .5 mm
Temperature Grade: INDUSTRIAL
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