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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | LMX5452SM/NOPB |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 60; Package Code: LFBGA; Package Shape: RECTANGULAR; |
| Datasheet | LMX5452SM/NOPB Datasheet |
| In Stock | 3,884 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.3 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 60 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B60 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 6 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA60,6X10,32 |
| Length: | 9 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/3.3 |
