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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | LMX9830SM/NOPB |
Description | TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 60; Package Code: LFBGA; Package Shape: RECTANGULAR; |
Datasheet | LMX9830SM/NOPB Datasheet |
In Stock | 848 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 2.75 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.3 mm |
Sub-Category: | Other Telecom ICs |
Surface Mount: | YES |
Maximum Supply Current: | .065 mA |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 60 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Data Rate: | .9216 Mbps |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B60 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | LFBGA |
Width: | 6 mm |
Moisture Sensitivity Level (MSL): | 4 |
Telecom IC Type: | TELECOM CIRCUIT |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA60,6X10,32 |
Length: | 9 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |
Temperature Grade: | AUTOMOTIVE |
Power Supplies (V): | 2.5/3.3 |