
Image shown is a representation only.
Manufacturer | Texas Instruments |
---|---|
Manufacturer's Part Number | OMAP3503DCBC |
Description | SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE; |
Datasheet | OMAP3503DCBC Datasheet |
In Stock | 3,103 |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.71 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.8 V |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | .9 mm |
Sub-Category: | Graphics Processors |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 515 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B515 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 90 Cel |
Package Code: | VFBGA |
Width: | 12 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | SYSTEM ON CHIP |
Maximum Supply Voltage: | 1.91 V |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA515,21X21,25 |
Length: | 12 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .4 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 1.1,1.8,3.3 |