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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | OMAP3503DCUS72 |
Description | SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | OMAP3503DCUS72 Datasheet |
In Stock | 1,147 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.71 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.8 V |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Maximum Seated Height: | 1.4 mm |
Sub-Category: | Graphics Processors |
Surface Mount: | YES |
No. of Terminals: | 423 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B423 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 90 Cel |
Package Code: | LFBGA |
Width: | 16 mm |
Peripheral IC Type: | SYSTEM ON CHIP |
Maximum Supply Voltage: | 1.91 V |
Minimum Operating Temperature: | 0 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA423,24X24,25 |
Length: | 16 mm |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | .8 mm |
Temperature Grade: | OTHER |
Power Supplies (V): | 1.1,1.2,1.8,1.8/3 |