Texas Instruments - OMAP3525ECBC

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

FS32R274KSK2MMM by NXP Semiconductors is a 32-bit microprocessor with integrated cache and boundary scan feature. It operates at a max clock frequency of 40 MHz, suitable for low power mode applications in automotive systems compliant with ISO 26262 standards. The package style is grid array, low profile, fine pitch, making it ideal for compact designs requiring high processing speeds.

Texas Instruments DM388AAARD11FP microprocessor features 32-bit architecture, 1.28-1.42V supply voltage range, and 30MHz clock frequency. Ideal for low power applications with integrated cache, 609 terminals, and 655360 RAM words.

The NXP Semiconductors MPC8270ZQMIBA is a 32-bit microprocessor with integrated cache and 64-bit external data bus width. It operates at a max clock frequency of 266 MHz, making it suitable for high-speed computing applications. With a package style of grid array and terminal finish of tin lead silver, this processor is ideal for commercial-grade systems requiring efficient processing power in a compact form factor.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Package Equivalence Code: BGA357,19X19,50;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;

MCIMX7D2DVK12SC by NXP Semiconductors is a Microprocessor with 32-bit size, 488 terminals, and 1.25V max supply voltage. Ideal for applications requiring low power mode, it features a CMOS technology, 16-bit external data bus width, and operates b/w 0-85°C temperature range.

AM3352BZCZ80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 26 MHz clock frequency, and 64 DMA channels. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

ADSP-21489KSWZ-5B by Analog Devices is a 40-bit microprocessor with 24-bit address bus width, 16-bit external data bus width, and max clock frequency of 25 MHz. It is used in commercial applications requiring high-speed processing capabilities.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

NXP's MIMXRT1171AVM8A microprocessor features integrated cache, 32 DMA channels, and 48 MHz clock frequency. Ideal for automotive applications due to its low power mode, CMOS technology, and wide temperature range (-40 to 125 °C).

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER;

STM32MP151AAD3 by STMicroelectronics is a 32-bit microprocessor with 48MHz clock frequency, 724992 RAM words, and 1.2V nominal voltage. Ideal for low power applications, it features 8 serial I/Os and 48 DMA channels in a compact square package suitable for various embedded systems.

The Renesas Electronics HD6417705F100BV is a 32-bit RISC microprocessor with 208 terminals and operates at speeds up to 100 rpm. It has power supplies of 1.5V and 3.3V, suitable for commercial-grade applications in various industries requiring high-speed processing capabilities. The microprocessor is housed in a square-shaped flatpack package with gull wing terminals, making it ideal for surface-mount assembly processes.