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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | OMAP3530ECUSA |
Description | MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 423; Package Code: LFBGA; Package Shape: SQUARE; |
Datasheet | OMAP3530ECUSA Datasheet |
In Stock | 1,031 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 1.4 mm |
Sub-Category: | Graphics Processors |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 423 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B423 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 105 Cel |
Package Code: | LFBGA |
Width: | 16 mm |
Moisture Sensitivity Level (MSL): | 4 |
Speed: | 720 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA423,24X24,25 |
Length: | 16 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .65 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 1.1,1.2,1.8,1.8/3 |