
Image shown is a representation only.
Manufacturer | Texas Instruments |
---|---|
Manufacturer's Part Number | TBP28L166N1 |
Description | OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Qualification: Not Qualified; |
Datasheet | TBP28L166N1 Datasheet |
In Stock | 4,936 |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Organization: | 2KX8 |
Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
Sub-Category: | OTP ROMs |
Surface Mount: | NO |
No. of Terminals: | 24 |
No. of Words: | 2048 words |
Terminal Position: | DUAL |
Package Style (Meter): | IN-LINE |
Technology: | TTL |
JESD-30 Code: | R-PDIP-T24 |
Package Shape: | RECTANGULAR |
Terminal Form: | THROUGH-HOLE |
Maximum Operating Temperature: | 70 Cel |
Package Code: | DIP |
Memory Density: | 16384 bit |
Memory IC Type: | OTP ROM |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 8 |
Qualification: | Not Qualified |
Package Equivalence Code: | DIP24,.6 |
No. of Words Code: | 2K |
Nominal Supply Voltage / Vsup (V): | 5 |
Peak Reflow Temperature (C): | NOT SPECIFIED |
Terminal Pitch: | 2.54 mm |
Temperature Grade: | COMMERCIAL |
Power Supplies (V): | 5 |