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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TBP28SA166JP4 |
| Description | OTP ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; No. of Words: 2048 words; |
| In Stock | 1,136 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC |
| Memory Density: | 16384 bit |
| Organization: | 2KX8 |
| Sub-Category: | OTP ROMs |
| Surface Mount: | NO |
| Memory IC Type: | OTP ROM |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 8 |
| No. of Terminals: | 24 |
| No. of Words: | 2048 words |
| Package Equivalence Code: | DIP24,.6 |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | TTL |
| Maximum Access Time: | 80 ns |
| No. of Words Code: | 2K |
| JESD-30 Code: | R-XDIP-T24 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIP |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | COMMERCIAL |
