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Manufacturer | Texas Instruments |
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Manufacturer's Part Number | TDA4AL88TGAALZRQ1 |
Description | SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 770; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; |
Datasheet | TDA4AL88TGAALZRQ1 Datasheet |
In Stock | 179 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .76 V |
Package Body Material: | PLASTIC/EPOXY |
Speed: | 2000 rpm |
Peripheral IC Type: | SYSTEM ON CHIP |
Nominal Supply Voltage: | .8 V |
Maximum Supply Voltage: | .84 V |
Maximum Seated Height: | 2.57 mm |
Surface Mount: | YES |
Minimum Operating Temperature: | -40 Cel |
No. of Terminals: | 770 |
Package Equivalence Code: | BGA770,28X28,32 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Screening Level: | AEC-Q100; ISO 26262 |
Length: | 23 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B770 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 125 Cel |
Package Code: | FBGA |
Width: | 23 mm |
Terminal Pitch: | .8 mm |
Moisture Sensitivity Level (MSL): | 3 |