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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TDA4AL88TGAALZRQ1 |
| Description | SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 770; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM; |
| Datasheet | TDA4AL88TGAALZRQ1 Datasheet |
| In Stock | 179 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .76 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | .8 V |
| Maximum Seated Height: | 2.57 mm |
| Surface Mount: | YES |
| No. of Terminals: | 770 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Screening Level: | AEC-Q100; ISO 26262 |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B770 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | FBGA |
| Width: | 23 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Other Names: |
296-TDA4AL88TGAALZRQ1CT 296-TDA4AL88TGAALZRQ1DKR 296-TDA4AL88TGAALZRQ1TR |
| Speed: | 2000 rpm |
| Peripheral IC Type: | SYSTEM ON CHIP |
| Maximum Supply Voltage: | .84 V |
| Minimum Operating Temperature: | -40 Cel |
| Package Equivalence Code: | BGA770,28X28,32 |
| Length: | 23 mm |
| Terminal Pitch: | .8 mm |









