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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TLK3138ZDU |
| Description | TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | TLK3138ZDU Datasheet |
| In Stock | 140 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2.42 mm |
| Sub-Category: | Network Interfaces |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 484 |
| No. of Transceivers: | 2 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Data Rate: | 3125 Mbps |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B484 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Width: | 23 mm |
| Moisture Sensitivity Level (MSL): | 4 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Functions: | 2 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA484,22X22,40 |
| Length: | 23 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 1.2,1.5,2.5 |
