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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | TMX320DM365BZCE |
| Description | MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 338; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | TMX320DM365BZCE Datasheet |
| In Stock | 4,507 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.14 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 1.3 mm |
| Sub-Category: | Digital Signal Processors |
| Surface Mount: | YES |
| No. of Terminals: | 338 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| Technology: | CMOS |
| RAM Words: | 8192 |
| JESD-30 Code: | S-PBGA-B338 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | LFBGA |
| Width: | 13 mm |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Maximum Supply Voltage: | 1.26 V |
| Bit Size: | 32 |
| Minimum Operating Temperature: | 0 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA338,19X19,25 |
| Length: | 13 mm |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | .65 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 1.2,1.8,3.3 |
