Texas Instruments - X66AK2G02ZBB60

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X66AK2G02ZBB60 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number X66AK2G02ZBB60
Description MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet X66AK2G02ZBB60 Datasheet
In Stock390
NAME DESCRIPTION
Minimum Supply Voltage: .85 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: .9 V
Integrated Cache: YES
Maximum Seated Height: 1.7 mm
Surface Mount: YES
No. of Terminals: 625
Terminal Position: BOTTOM
Format: FLOATING POINT
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Address Bus Width: 16
Technology: CMOS
JESD-30 Code: S-PBGA-B625
Maximum Clock Frequency: 26 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 90 Cel
Package Code: LFBGA
Width: 21 mm
Speed: 600 rpm
Peripheral IC Type: MICROPROCESSOR, RISC
Maximum Supply Voltage: .95 V
Low Power Mode: YES
Boundary Scan: YES
External Data Bus Width: 32
Minimum Operating Temperature: 0 Cel
Length: 21 mm
Terminal Pitch: .8 mm
Temperature Grade: OTHER
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