Texas Instruments - ZDM8147L3MOBCYE1

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ZDM8147L3MOBCYE1 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number ZDM8147L3MOBCYE1
Description MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 684; Package Code: HBGA; Package Shape: SQUARE; Maximum Seated Height: 3.06 mm;
Datasheet ZDM8147L3MOBCYE1 Datasheet
In Stock4,743
NAME DESCRIPTION
Minimum Supply Voltage: 3.14 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Supply Voltage: 3.47 V
Maximum Seated Height: 3.06 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
JESD-609 Code: e1
No. of Terminals: 684
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Length: 23 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B684
Package Shape: SQUARE
Terminal Form: BALL
Additional Features: IT ALSO OPERATES IN 1.71V MINIMUM SUPPLY
Peak Reflow Temperature (C): 250
Package Code: HBGA
Width: 23 mm
Terminal Pitch: .8 mm
Moisture Sensitivity Level (MSL): 4
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