Toshiba - TC51WHM716AXGN70

TC51WHM716AXGN70 by Toshiba

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Manufacturer Toshiba
Manufacturer's Part Number TC51WHM716AXGN70
Description Other Memory ICs; Temperature Grade: OTHER; No. of Terminals: 69; Package Code: FBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -25 Cel;
Datasheet TC51WHM716AXGN70 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000003 Amp
Organization: 8MX16
Output Characteristics: 3-STATE
Sub-Category: Other Memory ICs
Surface Mount: YES
Maximum Supply Current: 55 mA
No. of Terminals: 69
No. of Words: 8388608 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B69
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Input/Output Type: COMMON
Memory Density: 134217728 bit
Minimum Operating Temperature: -25 Cel
Memory Width: 16
Qualification: Not Qualified
Package Equivalence Code: BGA69,10X12,32
Maximum Access Time: 70 ns
No. of Words Code: 8M
Nominal Supply Voltage / Vsup (V): 3
Terminal Pitch: .8 mm
Temperature Grade: OTHER
Power Supplies (V): 3
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