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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | TC59LM813AMG-55 |
| Description | DDR1 DRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 60; Package Code: BGA; Package Shape: RECTANGULAR; Memory Density: 536870912 bit; |
| Datasheet | TC59LM813AMG-55 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 32MX16 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | DRAMs |
| Surface Mount: | YES |
| No. of Terminals: | 60 |
| Maximum Clock Frequency (fCLK): | 182 MHz |
| No. of Words: | 33554432 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B60 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | BGA |
| Input/Output Type: | COMMON |
| Memory Density: | 536870912 bit |
| Sequential Burst Length: | 2,4 |
| Memory IC Type: | DDR1 DRAM |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 16 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA60,6X15,40 |
| Interleaved Burst Length: | 2,4 |
| Maximum Access Time: | .75 ns |
| No. of Words Code: | 32M |
| Nominal Supply Voltage / Vsup (V): | 2.5 |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 2.5 |
