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| Manufacturer | Toshiba |
|---|---|
| Manufacturer's Part Number | TC59LM818DMBI-40 |
| Description | DDR1 DRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 60; Package Code: BGA; Package Shape: RECTANGULAR; Sequential Burst Length: 2,4; |
| Datasheet | TC59LM818DMBI-40 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 16MX18 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | DRAMs |
| Surface Mount: | YES |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| No. of Terminals: | 60 |
| Maximum Clock Frequency (fCLK): | 200 MHz |
| No. of Words: | 16777216 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B60 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Input/Output Type: | COMMON |
| Memory Density: | 301989888 bit |
| Sequential Burst Length: | 2,4 |
| Memory IC Type: | DDR1 DRAM |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 18 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA60,6X15,40 |
| Interleaved Burst Length: | 2,4 |
| Maximum Access Time: | .6 ns |
| No. of Words Code: | 16M |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 1.8,2.5 |
