Toshiba - THGBM1G6D4EBAI4

THGBM1G6D4EBAI4 by Toshiba

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Manufacturer Toshiba
Manufacturer's Part Number THGBM1G6D4EBAI4
Description FLASH; Temperature Grade: OTHER; No. of Terminals: 169; Package Code: LFBGA; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B169;
Datasheet THGBM1G6D4EBAI4 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 4GX16
Maximum Seated Height: 1.3 mm
Programming Voltage (V): 3.3
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 169
No. of Words: 4294967296 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B169
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 12 mm
Memory Density: 68719476736 bit
Memory IC Type: FLASH
JESD-609 Code: e1
Minimum Operating Temperature: -25 Cel
Memory Width: 16
No. of Functions: 1
Type: MLC NAND TYPE
Qualification: Not Qualified
Length: 18 mm
No. of Words Code: 4G
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: PARALLEL
Terminal Pitch: .5 mm
Temperature Grade: OTHER
Maximum Supply Voltage (Vsup): 3.6 V
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